Aluminum Heating Plate Water Cooling Plate
This Aluminum Heating Plate Water Cooling Plate is a water cold plate set with high cost performance. Size can be customized according to your requirements.
- Product Introduction
Aluminum Heating Plate Water Cooling Plate
Precision Thermal Management for High-Flux Applications
Master extreme thermal loads with our Aluminum Heating Plate Water Cooling Plates – engineered solutions that combine active liquid cooling with precision thermal distribution. Unlike standard cold plates, our integrated thermal management systems serve dual functions: distributing uniform heat for industrial processes while simultaneously removing 500W-15kW+ waste heat via optimized microchannel designs. We manufacture custom liquid-cooled heating platforms for semiconductor testing, EV battery modules, and laser systems where ±0.5°C surface uniformity is critical. Every plate undergoes CFD optimization and pressure integrity validation to ensure your thermal transfer solutions exceed performance and reliability demands.
Product Specification
This Aluminum Heating Plate Water Cooling Plate is a water cold plate set with high cost performance. Size can be customized according to your requirements.
| Construction |
Base Material: 6061-T6 Aluminum Fluid Channels: Laser-welded or vacuum-brazed |
| Thermal Performance |
Heat Flux Capacity: 100-500 W/cm² Temperature Uniformity: ±0.5°C @ 150°C |
| Fluid Channels |
Microchannel/Turbulator Designs Hydraulic Diameter: 0.8-3.0mm |
| Surface Options |
MIL-A-8625 Anodizing Ni-P Electroless Plating Conductive Coatings |
| Connection Standards |
NPT/G Threads JIC 37° Flare SAE O-Ring Boss |
| Material | Aluminum |
| Dimension | 304mm*138.5mm*26mm. Can be customized. |
Design Parameters

Application
Aluminum Heating Plate Water Cooling Plate is applicable to the core heat dissipation in many occasions, mainly used for the heat dissipation of large power equipment, and can also customize water-cooled products for various occasions according to user needs.
Our liquid-cooled heating plates solve critical challenges in:
EV Battery Module Testing (Temperature Cycling)
Semiconductor Wafer Processing
Laser Diode & CO2 Laser Cooling
Medical Device Sterilization Systems
Industrial Plastic Molding Platens
Aerospace Avionics Testing
High-Power RF Amplifiers
Research Reactor Components
Product Details




Manufacturing Process
Stage 1: Application Engineering
• Thermal mapping simulation • Flow distribution analysis • Structural FEA
Stage 2: Core Fabrication
Precision Machining:
5-axis milling of microchannels (±0.025mm)
Surface flatness machining (Ra ≤0.4μm)
Channel Sealing:
Vacuum brazing @ 590-620°C
Laser welding in argon atmosphere
Surface Enhancement:
Electropolishing for flow efficiency
Automated Ni-P plating (25-75μm)
Stage 3: Validation
Pressure testing to 2X operating pressure
Thermal uniformity mapping (IR imaging)
Flow resistance characterization
Helium mass spectrometry leak testing
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