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Aluminum Heating Plate Water Cooling Plate

This Aluminum Heating Plate Water Cooling Plate is a water cold plate set with high cost performance. Size can be customized according to your requirements.

  • Product Introduction

Aluminum Heating Plate Water Cooling Plate

Precision Thermal Management for High-Flux Applications 

 

 

 

Master extreme thermal loads with our Aluminum Heating Plate Water Cooling Plates – engineered solutions that combine active liquid cooling with precision thermal distribution. Unlike standard cold plates, our integrated thermal management systems serve dual functions: distributing uniform heat for industrial processes while simultaneously removing 500W-15kW+ waste heat via optimized microchannel designs. We manufacture custom liquid-cooled heating platforms for semiconductor testing, EV battery modules, and laser systems where ±0.5°C surface uniformity is critical. Every plate undergoes CFD optimization and pressure integrity validation to ensure your thermal transfer solutions exceed performance and reliability demands.

 

Product Specification

 

This Aluminum Heating Plate Water Cooling Plate is a water cold plate set with high cost performance. Size can be customized according to your requirements.

 

Construction

Base Material: 6061-T6 Aluminum

Fluid Channels: Laser-welded or vacuum-brazed

Thermal Performance

Heat Flux Capacity: 100-500 W/cm²

Temperature Uniformity: ±0.5°C @ 150°C

Fluid Channels

Microchannel/Turbulator Designs

Hydraulic Diameter: 0.8-3.0mm

Surface Options

MIL-A-8625 Anodizing

Ni-P Electroless Plating

Conductive Coatings

Connection Standards

NPT/G Threads

JIC 37° Flare

SAE O-Ring Boss

Material Aluminum
Dimension 304mm*138.5mm*26mm. Can be customized.

 

 

Design Parameters

 

Aluminum Heating Plate Water Cooling Plate drawing

 

 

Application

 

Aluminum Heating Plate Water Cooling Plate is applicable to the core heat dissipation in many occasions, mainly used for the heat dissipation of large power equipment, and can also customize water-cooled products for various occasions according to user needs.

 

Our liquid-cooled heating plates solve critical challenges in:

 

EV Battery Module Testing (Temperature Cycling)

Semiconductor Wafer Processing

Laser Diode & CO2 Laser Cooling

Medical Device Sterilization Systems

Industrial Plastic Molding Platens

Aerospace Avionics Testing

High-Power RF Amplifiers

Research Reactor Components

 

Product Details
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Manufacturing Process

 

Stage 1: Application Engineering
• Thermal mapping simulation • Flow distribution analysis • Structural FEA

Stage 2: Core Fabrication

Precision Machining:

5-axis milling of microchannels (±0.025mm)

Surface flatness machining (Ra ≤0.4μm)

Channel Sealing:

Vacuum brazing @ 590-620°C

Laser welding in argon atmosphere

Surface Enhancement:

Electropolishing for flow efficiency

Automated Ni-P plating (25-75μm)

Stage 3: Validation

Pressure testing to 2X operating pressure

Thermal uniformity mapping (IR imaging)

Flow resistance characterization

Helium mass spectrometry leak testing

 

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