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Large Pre-Drilled Flat High-Density Extruded Aluminum Heat Sink

One-piece aluminum extrusion heat sink with pre-drilled full mounting holes and single-side dense cooling fins, customized size for array COB lights and multi-module power inverters. CNC pre-machining available. Request your quote now.

  • Product Introduction

Large Pre-Drilled Flat High-Density Extruded Aluminum Heat Sink

For Multi-Chip Array High-Power Equipment

 

This large flat pre-drilled aluminum heat sink is manufactured by one-piece 6063-T5 aluminum extrusion. It features a wide thick flat top mounting plate with full CNC pre-drilled holes on the surface and ultra-dense vertical cooling fins on one side. It is a dedicated cooling solution for equipment with large-area multi-chip heat sources, such as array COB LED panels, multi-module inverters and laser power supplies. The two pictures display the 3D overall structure and the flat pre-drilled mounting surface separately.

 

Large Pre-Drilled Flat High-Density Extruded Aluminum Heatsinks1

 

 

 

Product Specification

 

Parameter Technical Details
Material 6063-T5 Aluminum Alloy
Thermal Conductivity 205–210 W/m·K
Profile Structure Thick solid flat top base with pre-drilled holes + single-side ultra-dense vertical fins
Custom Size Arbitrary cutting length & width from raw long extrusion bars
Machining Features Full pre-drilled mounting holes, positioning holes and counterbores finished by CNC in factory
Surface Treatments Mill silver finish, clear anodizing, black hard anodizing, sandblasting
Tolerance Standard ±0.1mm for cutting size; ±0.05mm for hole position accuracy

 

Product Features

 

1. Pre-Machined Complete Hole Layout, No Secondary Processing Required

All chip locking holes and chassis fixing holes are precisely CNC machined in advance according to customer drawings. Customers can directly mount power modules without outsourcing additional drilling work, cutting assembly time and extra processing costs.

 

2. Extra-Wide Solid Flat Base for Multi-Chip Array Heat Sources

The seamless thick flat top plate provides full contact surface for large PCBs, multiple IGBTs and COB chip arrays. Heat spreads evenly across the whole base to eliminate local hotspots caused by simultaneous operation of multiple heat-generating chips.

 

Large Pre-Drilled Flat High-Density Extruded Aluminum Heat Sink
 
Large Pre-Drilled Flat High-Density Extruded Aluminum Heat sinks
 
Large Pre-Drilled Flat High-Density Extruded Aluminum Heatsink
 

 

3. Single-Side Dense Fin Design Saves Cabinet Internal Space

Cooling fins are only arranged on one vertical side, leaving the entire top surface flat for component attachment. It avoids occupying extra horizontal space inside slim compact equipment enclosures.

 

4. One-Piece Extruded Structure with Excellent Flatness & Rigidity

Base and fins are integrally extruded without joints or welding. Long large-size radiators resist bending and warping, ensuring tight full contact between chips and the heat sink base for stable thermal transfer.

 

5. Full Customization Support for Dimension & Hole Pattern

We can adjust the overall length, width, fin height, base thickness and all hole layouts strictly based on your equipment CAD drawings. Flexible order volume covers prototype samples, small trial batches and mass OEM production.

 

Application

 

1. LED Lighting: multi-chip COB plant grow panels, high-power array wall wash lights, industrial UV curing flat lamps

2. Industrial Power Electronics: multi-module high-power switching power supplies, multi-IGBT array frequency inverters, multi-axis servo drivers

3. Special Industrial Equipment: laser engraving machine drive power supplies, multi-channel RF power amplifiers, centralized photovoltaic inverter modules

 

FAQs for this pre-drilled flat heat sin

 

FAQ 1: Are all the holes on the top surface customized according to my PCB drawing?

Yes. We conduct full CNC drilling, counterboring and tapping strictly following your CAD drawings. We can adjust hole diameter, hole spacing and hole distribution to match your chip layout and chassis fixing requirements, and finish all machining before delivery.

 

FAQ 2: Can this heat sink work for equipment with dozens of power chips arranged in array?

Absolutely. The wide thick seamless flat base offers a complete large contact plane for multi-chip arrays. It evenly distributes concentrated heat from multiple heat sources simultaneously to avoid temperature difference between chips and extend electronic component service life.

 

FAQ 3: Is this radiator suitable for both fanless natural cooling and forced air cooling with fans?

Yes. The ultra-dense evenly spaced vertical fins maximize heat exchange area. It delivers stable passive cooling performance for medium-power devices without fans, and achieves excellent high-power heat dissipation efficiency when paired with industrial axial cooling fans.

 

FAQ 4: What surface finish options do you offer to resist rust and scratch?

We supply 4 mainstream surface treatments: original mill silver finish, clear silver anodizing, black hard anodizing and sandblasting. Anodized layers greatly improve anti-corrosion and wear resistance for industrial and outdoor lighting long-term use.

 

FAQ 5: Can I order small batch samples with custom hole layouts for new product verification?

Yes. We support flexible order volumes including small prototype batches and mass OEM production. Raw long extrusion bars can be cut to your target size quickly, and our CNC workshop can finish custom hole machining with short sample lead time without expensive new mold costs.

 

 

 

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