Ultra Wide High Density Extruded Aluminum Heat Sink Series
Custom ultra-wide high-density fin aluminum heat sinks for industrial inverters, power supplies, and VFDs. Large-format profiles, high thermal efficiency, fully customizable. Request a quote now.
- Product Introduction
This ultra-wide high-density fin extruded aluminum heat sink series is purpose-built for large-format, high-power industrial and electronic equipment where maximum heat dissipation across a broad footprint is essential. Designed with an extra-wide solid base and ultra-fine, densely packed parallel fins, these heat sinks deliver exceptional thermal performance for applications with large heat-generating components or clustered power devices.
Manufactured from premium 6063-T5 aluminum alloy via one-piece extrusion, these heat sinks eliminate thermal interface resistance, ensuring uniform heat transfer across the entire structure. Available in multiple standard widths and customizable lengths, they are ideal for industrial inverters, power supply units, motor drives, and other high-power systems. We also offer full CNC machining and surface treatments to meet your exact integration requirements.
Product Specification
| Parameter | Technical Details |
| Material | 6063-T5 Aluminum alloy (standard); 6061-T6 (optional) |
| Thermal Conductivity | 205-210 W/m·K |
| Fin Design | 153*203 Ultra high density parallel fin array, optimized for maximum surface area |
| Standard Base Widths | 150mm, 200mm, 250mm, and custom sizes up to 300mm |
| Available Lengths | Custom cut lengths from 50mm-3000mm |
| Base Thickness | 5.0-10.0mm (solid, flat mounting surface) |
| Surface Treatments | Mill finish, clear/black anodizing, chromate conversion, powder coating |
| Tolerance | ±0.1mm (cut to length); ±0.2mm (fin and base dimensions) |
| Custom Services | CNC drilling, tapping, milling, deburring, custom mouting features |
Key Features & Benefits
Ultra-Wide Footprint for Large Heat-Load Applications
The extra-wide solid base provides full coverage for large PCBs, clustered power modules, or linear arrays of high-power components (such as MOSFETs, IGBTs, and rectifiers). This eliminates the need for multiple smaller heat sinks or additional thermal spreaders, simplifying your system design.
High-Density Fin Array for Maximum Cooling Efficiency
The ultra-fine, closely spaced fins maximize surface area within a compact height, delivering exceptional heat dissipation for both natural and forced convection cooling. Even at power levels exceeding 1kW, this profile maintains low operating temperatures when paired with standard industrial fans.
One-Piece Extruded Construction for Low Thermal Resistance
Unlike bonded or assembled heat sinks, this series is formed as a single continuous piece of aluminum. There are no thermal barriers between the base and fins, ensuring fast, uniform heat transfer across the entire heat sink and eliminating localized hotspots.
Robust Thermal Mass for Stable Performance
The thick, high-mass base acts as a thermal reservoir, absorbing and distributing transient heat spikes from high-power components. This improves thermal stability, reduces temperature fluctuations, and extends the lifespan of sensitive electronics.
Modular & Fully Customizable for System Integration
Available in multiple standard widths and fully customizable lengths, these heat sinks can be tailored to your exact enclosure and component layout. Optional CNC machining allows for pre-drilled mounting holes, threaded inserts, or custom cutouts to align with your assembly requirements.
Application
This ultra-wide high-density heat sink series is ideal for large-format high-power applications, including:
1. Industrial power electronics (high-power inverters, converters, and rectifier units)
2. Variable frequency drives (VFDs) and motor control systems
3. Rack-mount power supply units and telecom base station equipment
4. High-power audio amplifiers and broadcast transmitters
5. Renewable energy systems (solar inverters, battery storage power modules)
6. Medical equipment power supplies and industrial laboratory instrumentation
Why Choose Our Ultra-Wide High-Density Heat Sink Series?
1. Specialized expertise in complex, large-format aluminum extrusion for high-power industrial thermal management
2. A full range of standard profiles and fully customizable options to match your exact design requirements
3. In-house engineering support to optimize thermal performance for your specific heat load and enclosure
4. Competitive pricing for prototypes, small batches, and large-volume OEM orders
5. Compliance with ISO 9001, RoHS, and REACH standards for global market access
6. Dedicated international account management with multilingual support and reliable shipping
Contact our thermal engineering team today to discuss your custom ultra-wide high-density heat sink requirements, and let us provide a tailored solution for your high-power industrial or electronics application.
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