BGA Heat Sink Cross Cut Type
Aluminum BGA heatsink cross cut type is low profile, high efficiency cooling product which is ideal for linear air flow environment and has use thermal conductivity 6063 aluminum as material. The BGA heat sink is designed to cooling BGA chip.These devices mount with clip to provide optimum cooling at a very competitive price.
- Product Introduction
Product Description
Aluminum BGA heatsink cross cut type is low profile, high efficiency cooling product which is ideal for linear air flow environment and has use thermal conductivity 6063 aluminum as material. The BGA heat sink is designed to cooling BGA chip.These devices mount with clip to provide optimum cooling at a very competitive price. ZP as a BGA heatsink manufacturer, we can provide customer standard BGA heatsinks in stock, also we welcome to custom BGA heatsinks, or other heat sinks. Please contact our teams to get quotation.
Product Specification
Width | 25mm or customized |
Height | 10mm or customized |
Length | 25mm or customized |
Material | Aluminum alloy 6063 |
Shape | Square or rectangle |
Process | Plate pin |
Finish | Black Anodized |
Extra Process | CNC machining, Cross cutting |
Tolerance | 0.01mm |
Application
BGA - Ball Grid Array
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