video

High Power Modules Heat Sink

The heat dissipation effect of the radiator is not only related to the size of the radiator, but also related to factors such as ambient temperature and installation density.

  • Product Introduction

 

 

Specification

 

Dimension: Customized

Material: Aluminum

Color: Silver. Other colors are available

Surface Treatment: Anodizing

Application: Heat dissipation

Matched relay: Industrial SSR

Relay quantity: 1 pcs

Relay current: 60A-500A

 

Features

 

1.Intended for isolated power modules

2.Available in various lengths

3.Mounting channels are provided for the power modules as well as for additional accessories

 

Precautions for High Power Modules Heat Sink selection and use:

 

1. The heat dissipation effect of the radiator is not only related to the size of the radiator, but also related to factors such as ambient temperature and installation density. Therefore, the selection of the radiator is for reference only, please refer to the actual working temperature.

 

2.Standard reference for heat dissipation effect: The temperature of the contact surface between the bottom plate of the solid state relay and the radiator shall not exceed 80°C. Therefore, in practical applications, a 75℃ temperature switch can be installed on the radiator mounting surface near the edge of the solid state relay (within 20mm) for protection.

 

3. Above 60A, it is recommended to add fan forced cooling or water cooling.

 

4. Be sure to apply thermal grease between the relay base plate and the radiator.

 

5. When two or more solid state relays are installed side by side, a proper distance should be left.

 

Hot Tags: high power modules heat sink, China, suppliers, manufacturers, factory, customized, wholesale, buy, price, free sample, chip cooler heat sink, BGA Heat Sink Cross Cut Type, Aluminum Computer Cpu Heat Sink, Motherboard Chip Heat Sink, motherboard heatsink, chip heat sink

Send Inquiry

(0/10)

clearall