Custom Aluminum Hollow Inserted Fin Heatsink | Integrated Thermal Solution For High-Flux Applications
Our Custom Aluminum Hollow Inserted Fin Heatsink represents an advanced thermal architecture engineered for high-power-density electronics requiring efficient two-phase cooling. By integrating a hollow fin structure with a high-performance base, this design enables direct embedding of heat pipes or liquid cooling tubes within the fin array, creating a seamless and ultra-efficient thermal path for critical applications.
- Product Introduction
Our Custom Aluminum Hollow Inserted Fin Heatsink represents an advanced thermal architecture engineered for high-power-density electronics requiring efficient two-phase cooling. By integrating a hollow fin structure with a high-performance base, this design enables direct embedding of heat pipes or liquid cooling tubes within the fin array, creating a seamless and ultra-efficient thermal path for critical applications.
Products Description
The Aluminum Hollow Inserted Fin Heatsink is a sophisticated thermal management solution designed where conventional air cooling reaches its limits. It features a precision-machined aluminum base with an array of individually inserted fins, each fin manufactured with an internal hollow cavity. This cavity is engineered to securely accommodate standard or custom heat pipes, or micro liquid cooling channels, forming a monolithic cooling assembly that maximizes contact area and minimizes thermal interface resistance.
Product Parameters & Specifications
| Category | Details / Capabilities |
| Base Material | 6061-T6, 6063-T5 Aluminum (or custom alloys for specific CTE matching) |
| Fin Material | Aluminum (drawn or machined for hollow structure) |
| Hollow Fin Inner Diameter | 3mm – 8mm (standard for heat pipes), custom diameters available |
| Fin External Dimensions | Thickness: 1.0mm – 3.0mm; Height: 15mm – 100mm |
| Fin Pitch & Layout | Fully customizable based on airflow and integration requirements |
| Heat Pipe Integration | Compatible with 3mm, 4mm, 5mm, 6mm, 8mm round or flat heat pipes. |
| Liquid Channel Option | Design for integrated liquid cold plates (upon request). |
| Overall Heatsink Footprint | From 30x30mm up to 300x300mm or larger, multi-zone designs possible. |
| Surface Treatment | Anodizing (for electrical isolation or color), Nickel Plating, Passivation. |
| Pressure Rating (If liquid) | Design dependent; consult our engineering team |
| Thermal Performance | Designed for heat loads from 200W up to 1500W+ with forced air or liquid assist. |
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Product Features & Advantages
1. Direct Die-Attach Thermal Path: The hollow fin acts as a conduit for a heat pipe or liquid, creating a direct, low-resistance thermal bridge from the heat source mounted on the base to the entire fin stack.
2. Unmatched Design Freedom: Hollow fin geometry, pitch, height, and layout are fully customizable. Base can be machined for direct mounting of multiple high-power components (e.g., CPUs, GPUs, IGBTs).
3. Exceptional Thermal Density: Achieves superior heat spreading and dissipation in confined spaces, ideal for servers, telecom, and high-performance computing.
4. Modular & Serviceable Design: Allows for selective replacement or customization of the cooling elements (heat pipes) within the fin array if needed.
5. Structural Rigidity: The inserted fin design combined with the hollow structure, when integrated with a heat pipe, provides excellent mechanical stability and vibration resistance.
6. Hybrid Cooling Ready: Platform supports air cooling, heat pipe assisted air cooling, or can be adapted as a liquid-cooled condenser section.
Typical Applications
This advanced heatsink is the optimal choice for next-generation thermal challenges:
- High-Performance Computing (HPC) & Servers: Cooling for high-TDP CPUs, GPUs, and memory.
- Telecommunications & 5G Infrastructure: Massive MIMO AAUs, high-power RF amplifiers, and baseband units.
- Power Electronics & EV/HEV: Traction inverters, onboard chargers (OBC), DC-DC converters.
- Renewable Energy Systems: Central/string inverter cooling, photovoltaic optimizer cooling.
- Industrial Lasers & Medical Imaging Equipment: Where precise temperature control is critical.
- Aerospace & Defense Electronics: Ruggedized cooling for avionics and radar systems.
Production Process & Expertise
1. Thermal & Mechanical Design: Collaborative phase using CFD/FEA simulations to optimize fin layout, hollow cavity size, and base thickness for your specific heat sources and boundary conditions.
2. Precision Component Fabrication:
Base: CNC machined from a solid billet with high-accuracy grooves for fin insertion and component mounting features.
Hollow Fins: Manufactured via specialized drawing or machining processes to ensure consistent wall thickness and internal diameter.
3. Heat Pipe Integration (Typical Workflow): Custom heat pipes are bent, flattened (if required), and prepared. They are then inserted into the hollow fins.
4. Assembly & Bonding: The fin+heat pipe assemblies are inserted into the base grooves. The entire assembly undergoes a controlled soldering or brazing process in a vacuum or controlled atmosphere furnace to create a permanent, void-free metallurgical bond between all components.
5. Finishing & Quality Assurance: Post-assembly machining (if needed), surface treatment, and rigorous testing including thermal performance validation, pressure testing (for liquid), and dimensional inspection.
Why Partner With ZP HEAT SINK?
We specialize in transforming complex thermal challenges into reliable, manufactured solutions. For Hollow Inserted Fin Heatsinks, we provide:
- End-to-End Engineering: From conceptual thermal design to material selection and process validation.
- Advanced Manufacturing Capabilities: In-house precision machining, vacuum brazing/soldering, and comprehensive testing.
- Proven Experience in Two-Phase Cooling: Practical knowledge in integrating heat pipes and designing for phase-change efficiency.
- Confidentiality & IP Protection: Secure handling of your proprietary designs.
Request a Custom Thermal Solution Consultation
Elevate your product's performance with a fully integrated cooling module. Contact our engineering team with your thermal specs, footprint constraints, and power requirements for a detailed proposal.
Website: www.zpheatsink.com
Email:general@zp-aluminum.com
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